Partner Spotlight: ATLANT 3D Advancing Atomic-Scale Circular Microfabrication in CLOSER
October 29, 2026
As a key technology partner in the CLOSER project, ATLANT 3D combines its proprietary DALP® (Direct Atomic Layer Processing) technology with equipment engineering and materials expertise to develop advanced microfabrication systems that support more circular semiconductor manufacturing. The company’s NANOFABRICATOR® LITE platform enables localized, maskless materials processing with atomic-scale precision, supporting process development and device prototyping.
Building on this technology and expertise, ATLANT 3D is developing a dedicated system configuration for CLOSER, adapted to process gallium- and indium-based compounds derived from recovered materials for reuse in high-value semiconductor applications.
Within CLOSER, ATLANT 3D contributes to:
WP4 — Critical raw materials recovery: Supporting precursor preparation and compatibility with deposition processes under T4.3.
WP6 — Circular reuse: Designing and building a dedicated tool adapted to DALP® technology under T6.3, and demonstrating μDALP capabilities with recycled compounds under T6.4.
WP7 — Digital Passport for Traceability and Sustainability Analysis: Contributing to requirements and business use cases under T7.2.
Recent update
ATLANT 3D has now completed the design phase for the dedicated CLOSER tool adaptation, and manufacturing of the system is underway. The new configuration is being developed to enable controlled, localized processing of Ga- and In-based materials within ATLANT 3D’s atomic-scale manufacturing platform. This engineering step establishes the hardware foundation required for the next phase of the project, where recycled materials supplied through the CLOSER value chain will be introduced and evaluated.
This work connects ATLANT 3D with Dockweiler Chemicals, IFF@IFW Dresden and other CLOSER partners through a shared material pathway: converting recovered gallium and indium into suitable precursors, with indium-based compounds intended for subsequent atomic deposition at ATLANT 3D. This development is an important step toward demonstrating that recycled gallium and indium can be reintroduced into semiconductor manufacturing.
Next steps will focus on receiving and integrating the recycled material streams and optimizing the process window for their use with the adapted ATLANT 3D platform. The work supports CLOSER’s broader ambition to strengthen European semiconductor value chains by recovering and reusing strategic semiconductor materials from e-waste and industrial waste.